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COH--Chip on heatsink
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  • COH--Chip on heatsink

COH--Chip on heatsink

Chip on heatsink is a new fabrication technology for function surface and thick film functionally-gradient material (FGM) surface. IC with substrate can be directly soldered with AL heatsink Also can protect AL substrate while the TIM is Liquid metal from corrosion.

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Product Description

A new fabrication technology for function surface and thick film functionally-gradient material (FGM) surface

IC with substrate can be directly soldered with AL heatsink

Also can protect AL substrate while the TIM is Liquid metal from corrosion.

 

 

 

 

 

 

Thermal solution for AI chips ensures efficient heat dissipation, maintaining optimal performance and reliability. Designed for high-density AI processors, it prevents overheating, reduces energy consumption, and extends chip lifespan. Ideal for data centers, servers, and AI devices, it addresses critical thermal management challenges.

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