Laser Module Thermal Solutions
Starting from the system-level thermal model, study how to optimize the heat dissipation path to output most effective.
System-level heat dissipation path
Die active→Chip substrate→Die attach→Sink→solder→Copper cladding→Insulating film→Al substrate→Thermal grease→Heat sink→Ambinet
Thermal resistance distribution
•The thermal resistance of the heat sink, chip substrate, and insulating film accounts for more than 83%, which is the main directions for heat dissipation optimizations
•The main optimization directions for the heat sink's thermal resistance include the optimization of the fin parameters, as well as the increase of the material's thermal conductivity and the embedding of heat pipes/VC, etc.
•The optimization of the substrate mainly include using materials with better thermal conductivity and optimizing dimensions, such as replacing the commonly used sapphire with silicon carbide, silicon, etc.
•The optimization of the insulating film mainly focuses on reducing the inherent thermal resistance and the interfacial thermal resistance.
Our thermal solutions
•Replacing chip substrate material conventional sapphire with silicon carbide can reduce the system thermal resistance by about 18.6%.
•Improve the thermal performance of the insulating film, reducing the system thermal resistance by more than 4% (Thermal conductivity is increased from 2W/mk to 5W/mk).
