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Typical AMB
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  • Typical AMB

Typical AMB

AMB substrates bond copper to ceramics (e.g., Si₃N₄, AlN), offering high thermal conductivity (~90 W/m·K), low CTE mismatch, and superior reliability. Ideal for EV inverters, PV converters, and industrial drives, enabling efficient heat dissipation and high-power performance.

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Product Description

Characteristics:

• AMB substrates are fabricated by bonding metal layers (typically copper) to ceramic materials (e.g., Si₃N₄ or AlN) using active metal brazing techniques.

• High thermal conductivity (e.g., Si₃N₄ AMB offers ~90 W/m·K) and excellent mechanical strength.

• Superior thermal cycling resistance due to low coefficient of thermal expansion (CTE) mismatch between layers.

Advantages:

• High reliability: Suitable for high-temperature and high-power applications, such as EVs and industrial drives.

• Low parasitic inductance: Supports high-frequency switching, critical for SiC and GaN-based power modules.

• Enhanced thermal management: Efficient heat dissipation reduces thermal stress, extending module lifespan.

Applications:

• EV/HEV inverters: Dominates high-voltage traction systems due to robustness and thermal performance.

• Photovoltaic (PV) and wind energy: Used in converters requiring high reliability under harsh conditions.

• Industrial motor drives: Preferred for high-power density and durability.

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