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High Rebound Thermal Conductive Pad
High Rebound Thermal Conductive Pad
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  • High Rebound Thermal Conductive Pad
  • High Rebound Thermal Conductive Pad

High Rebound Thermal Conductive Pad

High Resilience Thermal Pad is a special interface filling material with high thermal conductivity up to 13.5W which is made of silicone resin by special formula and process. Low interfacial thermal resistance can be achieved at relatively low pressure. It can be used between heating power devices and radiating aluminum sheets or shell to effectively eliminate the air, which can reduce air contact thermal resistance and achieve effective filling effect.

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Product Description

High Resilience Thermal Pad Features：

- Broad Conductivity: 3W/m·K to 13.5W/m·K, balancing cost and performance.  
- Instant Installation: No curing—ready-to-use with consistent thickness (0.5mm–8mm options). 
- High Compressibility: Conforms to uneven surfaces, reducing interfacial resistance.  
- Electrical Insulation: High dielectric strength (≥5kV/mm) for sensitive components.  

Applictions:  
- Consumer electronics (smartphones, laptops, TVs)  
- Automotive electronics (ADAS, infotainment)  
- Telecom/5G base stations & industrial control systems  

Advantages:  
- Reusable, tear-resistant, and UL/ROHS compliant.  
- Stable performance from -40°C to 180°C.  

Product Structures：

Product Typical Features：

Thermal Conductivity Test Method：

Shelf Life and Storage Condition:
Shelf Life: 12 months
Storage Condition:15℃~35℃/0~65%RH in packing case.

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