Substrate-Multilayer CPC
CPC：a multilayer metal bonding with Cu and MoCu.
- High thermal conductivity (TC) than MoCu
- Low coefficient of thermal expansion (CTE) than Cu
CMC：a multilayer metal bonding with Cu and Mo.
- Higher TC than WCu and MoCu
- CTE stable, and matches with Si, GaAs and GaN.
Product Description
CPC multilayer composite copper alloy is an advanced material that combines high strength, high conductivity, and excellent wear resistance. It is made from multiple layers of copper alloys with varying properties through a precision composite process. Each layer is meticulously designed and processed, ensuring excellent conductivity while maintaining enhanced mechanical properties and longevity. It exhibits superior fatigue, wear, and corrosion resistance, enabling long-term stable operation in complex environments.
The unique advantage of this material lies in the synergistic effect of its multilayer structure. The outer layer is typically constructed of a highly wear-resistant copper alloy, providing excellent anti-friction properties, while the inner layer is constructed of a highly conductive alloy to ensure efficient electron or current transmission. This optimized interlayer design not only achieves balanced performance improvements but also significantly enhances the reliability and stability of the overall material.
In terms of processing and application, CPC multilayer composite copper alloy exhibits excellent plasticity and processability. It can be cut, stamped, rolled, or welded to meet diverse industrial and electronics requirements. Whether it is structural parts requiring high-strength support or electronic components demanding high conductivity, it provides stable and long-lasting performance.
|
Performance |
Parameter |
|
|
TC [W/(m·K)] @25℃ |
CPC141 |
220 |
|
CPC232 |
260 |
|
|
CPC111 |
280 |
|
|
CPC350 |
350 |
|
|
CTE [ppm/K] |
CPC141 |
8.8@20°C-200°C |
|
CPC232 |
9.3@20°C-200°C |
|
|
CPC111 |
9.4@20°C-200°C |
|
|
CPC350 |
11.8@20°C-200°C |
|
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