Power amplifier thermal solution
Thermal model schematic
We can provide kinds of Flange and TIM with heatsink depending on the thermal design requriments.
Following is what we have done :
Starting from the system-level thermal model, study how to optimize the heat dissipation path to output most effective
System-level heat dissipation path
GaN→SiC→Silver paste→Flange→Solder→Heat spreader→Thermal grease→Heat sink→Ambient
Thermal resistance distribution
- The thermal resistance of the heat sink, flange, and heat spreader accounts for more than 90%, which is the main direction for thermal optimizations
- The main optimization directions for the heat sink thermal resistance are the optimization of the fin parameters and the increase of the material's thermal conductivity
- The optimization directions for the thermal resistance of the flange and heat spreader are mainly the increase of the material's thermal conductivity and the optimization of the thermal design
Our thermal solutions
- The flange material is upgrated from the conventional CPC to diamond copper and carbon fiber copper, and through thermal design optimization, the system thermal resistance can be reduced by about 20% and 15% respectively
- The heat spreader material is replaced from the conventional copper to diamond copper, and through thermal design optimization, the system thermal resistance can be reduced by about 5%.
