Full-Suite Thermal Solutions from Chip Packaging to System-Level Heat Dissipation
Power amplifier thermal solution
Our advantage lies in recommending optimal thermal solutions based on the characteristics of the chip, its packaging method, and the application scenarios.
Power Module Thermal Solutions
Our advantage lies in recommending optimal thermal solutions based on the characteristics of the chip, its packaging method, and the application scenarios.
most effective
Laser Module Thermal Solutions
The thermal resistance of the heat sink, chip substrate, and insulating film accounts for more than 83%, which is the main directions for heat dissipation optimizations.
CPU/GPU/APUs Thermal Solutions
Thermal solutions for CPU/GPU/APUs，including TIM1,TIM1.5,TIM2 and heatsinks.
