Cu-w/Mo-Cu/kovar with Au plating
Unique electroplating process that can achieve partial electroplating on both sides (meeting the needs of die pasting and plate loading respectively), as well as the ability to have no coating on the sides (preventing tin crawling).
Product Description
| Cu-W list | |||
| Alloy grade | Proportion | Thermal conductivity | Thermal expansion coefficient |
| WCu7 | 17.5 | 150 | 5.5 |
| WCu10 | 17.0 | 160 | 6.2 |
| WCu15 | 16.2 | 170 | 6.9 |
| WCu20 | 15.4 | 180 | 7.4 |
| WCu25 | 14.7 | 200 | 8.0 |
| WCu30 | 14.1 | 220 | 8.8 |
| Mo-Cu list | |||||
| Brand | Molybdenum content Wt% | Copper content Wt% | Density g/cm3 | Thermal conductivity W/(M.K) | Thermal expansion coefficient (10-6/K) |
| Mo85Cu15 | 85+ 1 | Balance | 10 | 160-180 | 6.8 |
| Mo80Cu20 | 80±1 | Balance | 9.9 | 170-190 | 7.7 |
| Mo70Cu30 | 70±1 | Balance | 9.8 | 180-200 | 9.1 |
| Mo60Cu40 | 60±1 | Balance | 9.66 | 210-250 | 10.3 |
| Mo50Cu50 | 50 ±0.2 | Balance | 9.54 | 230-270 | 11.5 |
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