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Thermal Gel（Ultra low density , low CVCM , high thermal conductivity）
Thermal Gel（Ultra low density , low CVCM , high thermal conductivity）
Thermal Gel（Ultra low density , low CVCM , high thermal conductivity）
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  • Thermal Gel（Ultra low density , low CVCM , high thermal conductivity）
  • Thermal Gel（Ultra low density , low CVCM , high thermal conductivity）
  • Thermal Gel（Ultra low density , low CVCM , high thermal conductivity）

Thermal Gel（Ultra low density , low CVCM , high thermal conductivity）

Thermal Gel is a silicone-based thermal interface material offering high conductivity and excellent conformability. Its viscoelastic properties enable low thermal resistance under minimal pressure, effectively filling air gaps between heat sources and cooling components. The self-leveling gel adapts to surface irregularities while resisting pump-out, ensuring stable performance. Ideal for electronics cooling, it enhances heat transfer efficiency compared to traditional TIMs.

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Product Description

A premium thermal interface material engineered for high-stakes thermal management:

Enhanced Conductivity: 3W/m·K to 14W/m·K, ideal for extreme heat dissipation.

Fast Curing: Forms a durable, elastic layer post-curing for permanent bonding.

Superior Stability: Resists thermal cycling, mechanical stress, and chemical exposure.

Precision Application: Optimized for automated dispensing in mass production.

Applications:

High-power electronics (servers, AI/ML hardware)

Electric vehicles (motor controllers, charging systems)

Renewable energy (solar inverters, wind turbines)

Advantages:

Exceptional long-term reliability (10+ years).

Maintains performance in -50°C to 150°C environments.

Product Typical Features：

Packaging & Storage
Available in syringe packaging: 25cc+25cc and 200cc+200cc.

Storage Condition:22℃~28℃，0~65%RH in packing case.
Can be transported as ordinary chemicals at room temperature.

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