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Typical DBC & DPC
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  • Typical DBC & DPC

Typical DBC & DPC

DBC bonds copper to ceramics (e.g., Al₂O₃, AlN), offering high insulation (up to 3.3 kV) and moderate thermal conductivity (~24 W/m·K). Cost-effective and solderable, ideal for UPS systems, medium-power inverters, and telecom power supplies.

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Product Description

Characteristics:

• DBC involves direct bonding of copper foils to ceramic substrates (commonly Al₂O₃ or AlN) via high-temperature oxidation.

• High electrical insulation (up to 3.3 kV) and moderate thermal conductivity (e.g., Al₂O₃ DBC: ~24 W/m·K).

Advantages:

• Cost-effectiveness: Lower material and processing costs compared to AMB.

• Simplified design: Suitable for medium-power applications with straightforward thermal requirements.

• Good solderability: Facilitates easy integration with power dies and interconnects.

Applications:

• Consumer electronics: Widely used in UPS systems and home appliances for cost-sensitive designs.

• Rail traction and medium-power inverters: Balances performance and affordability in industrial settings.

• Telecom infrastructure: Deployed in power supplies requiring stable thermal performance.

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