Markets

• Power Amplifier

• laser module

• CPU/GPU/APU

• Power Module

Product

• IC Substrate

  • Cu-w/Mo-Cu/kovar with Au Plating

  • Substrate-Multilayer CPC

  • Diamond Cu

  • ACP

  • Typical DBC

  • Typical AMB

  • IMS-Die on Heatsink

  • COH-Chip on Heatsink

  • LED Module

  • XPUs with Lid

  • XPUs without Lid

• Thermal Interface Materials

  • Themal Grease

  • Thermal Pad

  • High DBV Insulation Film

  • Eltra-High Thermal Conductivity Pad

  • Thermal Gel

• Thermal Module & Heatsink

  • GPUs

  • CPUs

  • Switchs Devices

  • Servers Equipment

Capabilities

• Thermal design

• Wire cutting equipment

• Die casting equipment

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