COH--Chip on heatsink
Chip on heatsink is a new fabrication technology for function surface and thick film functionally-gradient material (FGM) surface.
IC with substrate can be directly soldered with AL heatsink
Also can protect AL substrate while the TIM is Liquid metal from corrosion.
Product Description
A new fabrication technology for function surface and thick film functionally-gradient material (FGM) surface
IC with substrate can be directly soldered with AL heatsink
Also can protect AL substrate while the TIM is Liquid metal from corrosion.

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