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    • IMS-Die on Heatsink

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    • High DBV Insulation Film

    • Eltra-High Thermal Conductivity Pad

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    • CPUs

    • Switch Devices

    • Servers Equipment

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    • Cu-w/Mo-Cu/kovar with Au Plating

    • Substrate-Multilayer CPC

    • Diamond Cu

    • Typical AMB

    • Typical-DBC&DPC

    • IMS-Die on Heatsink

    • COH-Chip on Heatsink

  • Thermal Interface Materials

    • Thermal Grease

    • High Resilience Thermal Pad

    • High DBV Insulation Film

    • Eltra-High Thermal Conductivity Pad

    • Thermal Gel

  • Thermal Module & Heatsink

    • GPUs

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< 12 >

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  • Markets

    • Power Amplifier

    • laser module

    • CPU/GPU/APU

    • Power Module

  • Product

    • IC Substrate

      • Cu-w/Mo-Cu/kovar with Au Plating

      • Substrate-Multilayer CPC

      • Diamond Cu

      • ACP

      • Typical DBC

      • Typical AMB

      • IMS-Die on Heatsink

      • COH-Chip on Heatsink

      • LED Module

      • XPUs with Lid

      • XPUs without Lid

    • Thermal Interface Materials

      • Themal Grease

      • Thermal Pad

      • High DBV Insulation Film

      • Eltra-High Thermal Conductivity Pad

      • Thermal Gel

    • Thermal Module & Heatsink

      • GPUs

      • CPUs

      • Switchs Devices

      • Servers Equipment

  • Capabilities

    • Thermal design

    • Wire cutting equipment

    • Die casting equipment

  • About

    • Company Profile

    • Our vision and mission

  • News

  • Contact Us

    • Message

    • Contact

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