Msteed Technology-Thermal interface materials-Power system heatsink solution

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Full-Suite Thermal Solutions from<br>Chip Packaging to System<br>Level Heat Dissipation

Full-Suite Thermal Solutions from
Chip Packaging to System
Level Heat Dissipation

End to end products and solution from IC to cooling
machine

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Full-Suite Thermal Solutions from
Chip Packaging to System
Level Heat Dissipation

End to end products and solution from IC to cooling
machine

learn more +

Full-Suite Thermal Solutions from
Chip Packaging to System
Level Heat Dissipation

End to end products and solution from IC to cooling
machine

learn more +

Full-Suite Thermal Solutions from
Chip Packaging to System
Level Heat Dissipation

End to end products and solution from IC to cooling
machine

learn more +

MARKETS

Power amplifier thermal solution

Our advantage lies in recommending optimal thermal solutions based on the characteristics of the chip, its packaging method, and the application scenarios.

Power Module Thermal Solutions

Our advantage lies in recommending optimal thermal solutions based on the characteristics of the chip, its packaging method, and the application scenarios. most effective

Laser Module Thermal Solutions

The thermal resistance of the heat sink, chip substrate, and insulating film accounts for more than 83%, which is the main directions for heat dissipation optimizations.

CPU/GPU/APUs Thermal Solutions

Thermal solutions for CPU/GPU/APUs，including TIM1,TIM1.5,TIM2 and heatsinks.

OUR PRODUCTS

1U Heatpipe heatsink 13

1U Heatpipe heatsink 12

1U Heatpipe heatsink 11

1U Heatpipe heatsink 10

1U Heatpipe heatsink 9

1U Heatpipe heatsink 8

1U Heatpipe heatsink 7

1U Heatpipe heatsink 6

ALL PRODUCTS +

APPLICATION AREA

IC package

They effectively solve the problem of heat accumulation during packaging through the introduction of high thermal conductivity layers or liquid cooling designs, improving chip computing power and overall operational efficiency.

Consumer electronics

The application of heat dissipation products in consumer electronics is extensive, such as mobile phones and laptops, ensuring stable operation of the devices. These products not only enrich daily life but also improve work efficiency.

Power systems

Heat dissipation products are mainly used in power systems as cooling devices, such as radiators, fans, and coolants, to reduce the temperature of electronic components and improve the reliability and stability of power systems.

AI Thermal solution

The application of cooling products in data centers is crucial for ensuring stable server operation, effectively preventing overheating, and improving system reliability.

ABOUT US

Established on 2017

Based on deed understanding of the architecture of electrical products , we successfully support a series customers with most cost-effective thermal solutions and products on IC package, consumer electronics , power systems ,data center ,ICT equipment ,and automotive devices.

Our products and solution focus on such components : SOC ,memory ,PA, power components, laser.

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