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advanced AMB substrate companies
Advanced AMB substrate companies deliver high-performance electronic materials with precision and durability.
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AMB substrates bond copper to ceramics (e.g., Si₃N₄, AlN), offering high thermal conductivity (~90 W/m·K), low CTE mismatch, and superior reliability. Ideal for EV inverters, PV converters, and industrial drives, enabling efficient heat dissipation and high-power performance.
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