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CPC multilayer composite copper alloy

CPC multilayer composite copper alloy is a high-performance thermal and electrical conductive material composed of multiple bonded copper-based layers with varying compositions. Each layer is designed to achieve an optimized balance of strength, conductivity, and heat dissipation. The multilayer structure allows for precise control over material properties, improving overall thermal stability and structural durability.
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Substrate-Multilayer CPC


<p><span style="font-size:16px;"><strong>CPC:a multilayer metal bonding with Cu and MoCu.</strong> </span></p> <ul> <li><span style="font-size:16px;">High thermal conductivity (TC) &nbsp;than MoCu</span></li> <li><span style="font-size:16px;">Low coefficient of thermal expansion (CTE) &nbsp;than Cu</span></li> </ul> <p>&nbsp;</p> <p><span style="font-size:16px;"><strong>CMC:a multilayer metal bonding with Cu and Mo.</strong> </span></p> <ul> <li><span style="font-size:16px;">Higher TC than WCu and MoCu</span></li> <li><span style="font-size:16px;">CTE stable, and matches with Si, GaAs and GaN.</span></li> </ul>