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AI thermal solution

An AI thermal solution refers to a specialized cooling system designed to manage the significant heat generated by artificial intelligence computing hardware. It integrates advanced thermal materials, optimized heat sinks, and intelligent heat flow control strategies to ensure stable operation of high-performance processors. These solutions combine fluid dynamics, thermal conduction, and intelligent design to achieve rapid heat dissipation and precise temperature control.
Products

Thermal Grease


Thermal Grease is a special interface filling material with high thermal conductivity which is made of silicone resin by special formula and process. Low interfacial thermal resistance can be achieved at relatively low pressure. It can be used between heating power devices and radiating aluminum sheets or shell to effectively eliminate the air, which can reduce air contact thermal resistance and achieve effective filling effect.

Thermal Gel(Ultra low density , low CVCM , high thermal conductivity)


Thermal Gel is a silicone-based thermal interface material offering high conductivity and excellent conformability. Its viscoelastic properties enable low thermal resistance under minimal pressure, effectively filling air gaps between heat sources and cooling components. The self-leveling gel adapts to surface irregularities while resisting pump-out, ensuring stable performance. Ideal for electronics cooling, it enhances heat transfer efficiency compared to traditional TIMs.