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    • IMS-Die on Heatsink

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Thermal Module & Heatsink

AMD SP3 1U Heatpipe heatsinks

AMD SP3 1U Heatpipe heatsinks

AMD SP3 2U Heatpipe heatsink

AMD SP3 2U Heatpipe heatsink

AMD SP3 1.5U Heatpipe heatsink

AMD SP3 1.5U Heatpipe heatsink

AMD SP5 1U Heatpipe heatsink

AMD SP5 1U Heatpipe heatsink

AMD 1U T type Heat pipe heatsink

AMD 1U T type Heat pipe heatsink

Nvidia GeForce GTX 760

Nvidia GeForce GTX 760

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Nvidia A100 sxm4

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Nvidia RTX 3070

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Nivdia GTX960/970/980

Alpenfohn Peter

Alpenfohn Peter

Nvidia A2000

Nvidia A2000

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Nvidia GTX 1060

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  • Markets

    • Power Amplifier

    • laser module

    • CPU/GPU/APU

    • Power Module

  • Product

    • IC Substrate

      • Cu-w/Mo-Cu/kovar with Au Plating

      • Substrate-Multilayer CPC

      • Diamond Cu

      • ACP

      • Typical DBC

      • Typical AMB

      • IMS-Die on Heatsink

      • COH-Chip on Heatsink

      • LED Module

      • XPUs with Lid

      • XPUs without Lid

    • Thermal Interface Materials

      • Themal Grease

      • Thermal Pad

      • High DBV Insulation Film

      • Eltra-High Thermal Conductivity Pad

      • Thermal Gel

    • Thermal Module & Heatsink

      • GPUs

      • CPUs

      • Switchs Devices

      • Servers Equipment

  • Capabilities

    • Thermal design

    • Wire cutting equipment

    • Die casting equipment

  • About

    • Company Profile

    • Our vision and mission

  • News

  • Contact Us

    • Message

    • Contact

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